Stable and Metastable Phase Equilibria Involving the Cu6Sn5 Intermetallic

نویسندگان

چکیده

Abstract Cu 6 Sn 5 intermetallic occurs in the form of differently ordered phases ?, ?? and ???. In solder joints, this can undergo changes composition state order without or while interacting with excess system, potentially giving rise to detrimental mechanical properties solder. study such processes fundamental detail get more detailed information about metastable stable phase equilibria, model alloys consisting 3 + as well Sn-rich melt were heat treated. Powder x-ray diffraction scanning electron microscopy supplemented by backscatter used investigate structural microstructural changes. It was shown that Sn-poor ? increase its content precipitation at grain boundaries uptake from melt. From kinetics former process 513 K size phase, we obtained an interdiffusion coefficient (3 ± 1) × 10 ?16 m 2 s ?1 . Comparison value literature data implies reflects pure volume (inter)diffusion, growth low temperature is typically strongly influenced grain-boundary diffusion. These investigations also confirm ??? forming below a composition-dependent transus gradually enriches content, confirming against decomposition into (at lower temperatures) ??. Graphic

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ژورنال

عنوان ژورنال: Journal of Electronic Materials

سال: 2021

ISSN: ['0361-5235', '1543-186X']

DOI: https://doi.org/10.1007/s11664-021-09067-4